Flow stress of lead-free solder alloys over a broad range of temperatures and strain rates

T. Chen; X.Y. Niu; Z.G. Li; X.F. Shu

doi:doi:10.1051/dymat/2009203

All issues

Volume 2 (2009)

10.1051/dymat/2009203

Abstract

Issue		DYMAT 2009 Volume 2, 2009 DYMAT 2009 - 9th International Conference on the Mechanical and Physical Behaviour of Materials under Dynamic Loading


Page(s)		1437 - 1442
Section		Constitutive Modeling
DOI		https://doi.org/10.1051/dymat/2009203
Published online		15 September 2009

DYMAT 2009 (2009) 1437-1442
DOI: 10.1051/dymat/2009203

Flow stress of lead-free solder alloys over a broad range of temperatures and strain rates

T. Chen, X.Y. Niu, Z.G. Li and X.F. Shu

Institute of Applied Mechanics & Biomedical Engineering, Taiyuan University of Technology, No.79 West Yingze Street, Taiyuan 030024, Shanxi, PR China

shuxf@tyut.edu.cn

Published online: 15 September 2009

Abstract
Solder balls are recognized as vital parts for the integrity of solder joints and the overall function of package. The solder joints reliability of electronic packages during board level drop impact is of great concern to semiconductor manufacturers. To obtain the true mechanical behavior of solder alloys under high strain rate and different temperature, Sn3.0Ag0.5Cu, Sn3.5Ag and 63Sn37Pb were investigated by quasi-static tests and the split Hopkinson pressure bar. From the test data, it was found that yield strength and flow stress increased remarkably with the increase of strain rate. The three materials are sensitive to strain rate and thermal effect. The higher the temperature, the smaller their flow stresses.