Dynamic constitutive relationship of lead-free solder alloys based on Johnson-Cook model with thermal effect

X.Y. Niu; T. Chen; Z.G. Li; X.F. Shua

doi:doi:10.1051/dymat/2009119

All issues

Volume 1 (2009)

10.1051/dymat/2009119

Abstract

Issue		DYMAT 2009 Volume 1, 2009 DYMAT 2009 - 9th International Conference on the Mechanical and Physical Behaviour of Materials under Dynamic Loading


Page(s)		855 - 859
Section		Industrial Applications
DOI		https://doi.org/10.1051/dymat/2009119
Published online		15 September 2009

DYMAT 2009 (2009) 855-859
DOI: 10.1051/dymat/2009119

Dynamic constitutive relationship of lead-free solder alloys based on Johnson-Cook model with thermal effect

X.Y. Niu, T. Chen, Z.G. Li and X.F. Shua

Institute of Applied Mechanics & Biomedical Engineering, Taiyuan University of Technology, No.79 West Yingze Street, Taiyuan 030024 Shanxi, PR China

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Published online: 15 September 2009

Abstract
Based on the experimental data in our previous paper, the measured stress-strain data at different strain rates and temperature are incorporated in Johnson-Cook constitutive equation and a modified Johnson-Cook constitutive equation which can adequately represent the rate-sensitive deformation response and thermal effect during high-rate loading. The modified Johnson-Cook constitutive equation is more suitable for expressing the dynamic behavior of the solder alloy in the vicinity of the recrystallization temperature. Compared with the typical Pb-containing solder Sn63Pb37, the lead-free solder showed some fine properties and could substitute some Pb-containing solder alloys in microelectronic components packaging and interconnects.