DYMAT 2009
Volume 2, 2009
DYMAT 2009 - 9th International Conference on the Mechanical and Physical Behaviour of Materials under Dynamic Loading
Page(s) 1745 - 1751
Section Numerical Simulations
Published online 15 September 2009
DYMAT 2009 (2009) 1745-1751
DOI: 10.1051/dymat/2009246

Response of bonded assembly under shock wave loading

D. Laporte1, F. Malaise1, P.-L. Hereil2, E. Buzaud2 and J.-M. Chevalier1

1  Centre d'Études Scientifiques et Techniques d'Aquitaine, 33114 Le Barp, France
2  Centre d'Études de Gramat, 46500 Gramat, France

Published online: 15 September 2009

The dynamic behaviour of epoxy resin under shock wave loading was investigated in the 200–700 MPa range. Plate impact experiments were performed and successfully simulated using a 1D shock wave propagation code and a Maxwellian model. The response of aluminium bonded assemblies was also studied by gas gun experiments and 1D computations. It was shown that debonding can be detected by the analysis of velocity interferometer measurements, as already achieved by Laser Adhesion Test.

© EDP Sciences 2009