Response of bonded assembly under shock wave loading

D. Laporte; F. Malaise; P.-L. Hereil; E. Buzaud; J.-M. Chevalier

doi:doi:10.1051/dymat/2009246

All issues

Volume 2 (2009)

10.1051/dymat/2009246

Abstract

Issue		DYMAT 2009 Volume 2, 2009 DYMAT 2009 - 9th International Conference on the Mechanical and Physical Behaviour of Materials under Dynamic Loading


Page(s)		1745 - 1751
Section		Numerical Simulations
DOI		https://doi.org/10.1051/dymat/2009246
Published online		15 September 2009

DYMAT 2009 (2009) 1745-1751
DOI: 10.1051/dymat/2009246

Response of bonded assembly under shock wave loading

D. Laporte¹, F. Malaise¹, P.-L. Hereil², E. Buzaud² and J.-M. Chevalier¹

¹ Centre d'Études Scientifiques et Techniques d'Aquitaine, 33114 Le Barp, France
² Centre d'Études de Gramat, 46500 Gramat, France

Published online: 15 September 2009

Abstract
The dynamic behaviour of epoxy resin under shock wave loading was investigated in the 200–700 MPa range. Plate impact experiments were performed and successfully simulated using a 1D shock wave propagation code and a Maxwellian model. The response of aluminium bonded assemblies was also studied by gas gun experiments and 1D computations. It was shown that debonding can be detected by the analysis of velocity interferometer measurements, as already achieved by Laser Adhesion Test.