Volume 1, 2009DYMAT 2009 - 9th International Conference on the Mechanical and Physical Behaviour of Materials under Dynamic Loading
|Page(s)||855 - 859|
|Published online||15 September 2009|
Dynamic constitutive relationship of lead-free solder alloys based on Johnson-Cook model with thermal effectX.Y. Niu, T. Chen, Z.G. Li and X.F. Shua
Institute of Applied Mechanics & Biomedical Engineering, Taiyuan University of Technology, No.79 West Yingze Street, Taiyuan 030024 Shanxi, PR China
Published online: 15 September 2009
Based on the experimental data in our previous paper, the measured stress-strain data at different strain rates and temperature are incorporated in Johnson-Cook constitutive equation and a modified Johnson-Cook constitutive equation which can adequately represent the rate-sensitive deformation response and thermal effect during high-rate loading. The modified Johnson-Cook constitutive equation is more suitable for expressing the dynamic behavior of the solder alloy in the vicinity of the recrystallization temperature. Compared with the typical Pb-containing solder Sn63Pb37, the lead-free solder showed some fine properties and could substitute some Pb-containing solder alloys in microelectronic components packaging and interconnects.
© EDP Sciences 2009