Dynamic response of electronic systems to shocks and vibrations: Application of analytical (mathematical) modeling

Physical Sciences and Engineering Research Division, Basic Research, Bell Labs, Murray Hill, NJ, USA (ret)
Department of Electrical Engineering, University of California, Santa Cruz, CA, USA
Department of Mechanical Engineering, University of Maryland, College Park, MD, USA
Department of Electronic Materials, Technical University, Vienna, Austria
ERS Co. LLC, Los Altos, CA, USA

Abstract

Some basic problems of the dynamic response of electronic and photonic (E&P) systems to shocks and vibrations are addressed and discussed. The emphasis is on analytical (mathematical) modeling, the reliability physics behind the addressed phenomena, and design-for-reliability (DfR) issues and challenges. The addressed problems include 1) linear response: effect of viscous damping, shock tests vs. drop tests, role of compliant interfaces, and maximum acceleration and maximum dynamic stress as a suitable reliability criterion; 2) nonlinear response: printed circuit board (PCB) experiencing an impact load applied to its support contour and ball-grid-array (BGA) testing on the board level; 3) shock protection of portable electronics, including the possible use of nano-wires as a suitable protective “cushion”. The fruitfulness of the probabilistic DfR (PDfR) concept to quantify and assure the field (operational) reliability of E&P devices and systems is also indicated.